天津汉高乐泰FP4549底部填充胶半导体,乐泰FP4549

LOCTITE ECCOBOND FP4549 liquid epoxy adhesive is designed for
enhanced adhesion to integrated circuit passivation materials. This
material is formulated to quickly underfill devices at 90°C to 110°C with
as little as a 1/2 mil gap. When fully cured, the material forms a rigid,
low stress seal that dissipates stress on solder joints and extends
thermal cycling performance.北京汐源科技有限公司 导电胶 绝缘胶 半导体材料 划片液 键合金丝

TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Die Shear Strength, Kg:
Nitride Passivated/FR4 substrate:
100 mil x 100 mil die @ 25°C 50±2

LOCTITE ECCOBOND LUX OGR150THTG photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain shadowed areas where light is unable to penetrate. The secondary thermal cure can be done in conventional box or convection conveyor ovens.
Ablestik光通信器件胶，高透光UV胶，光纤尾胶，光纤头胶，通过双85测试，耐低温-65度。



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